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精品推薦 | IGBT多芯片貼合機(jī)

2023-08-21 15:03

設(shè)備外形（Equipment Appearance）

總性能優(yōu)勢(shì)（Performance Advantages）

精度高，產(chǎn)量多

貼合位置精度±10μm，角度精度±0.1°，且滿足3δ標(biāo)準(zhǔn)。每小時(shí)產(chǎn)量可達(dá)2000，以標(biāo)準(zhǔn)單顆產(chǎn)品貼一個(gè)焊片+一個(gè)芯片為基準(zhǔn)，設(shè)備單次取貼片時(shí)間可控制在0.9s以內(nèi)。

Bonding accuracy is ±10μm, Angle accuracy is ±0.1°. The UPH is 2000, with a solder preform and a chip as the benchmark, the cycle time of equipment is within 0.9s.

兼容性強(qiáng)，能兼容多尺寸晶圓盤

可兼容12寸、8寸、6寸及4寸晶圓盤來(lái)料，同時(shí)兼容Tray盤來(lái)料。

Be compatible with 12 inch, 8 inch, 6 inch and 4 inch wafer, and compatible with Tray.

力控范圍大，誤差小

力控范圍40~1000gf，力控誤差在250gf以下能控制在5%以內(nèi)，250gf以上則可控制在10%以內(nèi)。

Bond Force is 40~1000gf, the deviation is within 5% (below 250gf) and is 10% (higher 250g).

組件結(jié)構(gòu)的特色（Modules）

絕對(duì)值編碼器，省時(shí)省力

軌道調(diào)寬機(jī)構(gòu)使用帶絕對(duì)值編碼器的伺服電機(jī)進(jìn)行驅(qū)動(dòng)，便于一鍵切換來(lái)料載盤尺寸，減少人工調(diào)節(jié)的時(shí)間。

The index width is adjustable by servo motor that to load different size tray, also decrease conversion time of package.

多段諧波凸輪，沖擊小，低風(fēng)險(xiǎn)

載盤抬升使用多段諧波凸輪，減少了傳動(dòng)鏈，加快了升降機(jī)構(gòu)的響應(yīng)速度，同時(shí)諧波凸輪曲線減少了載盤上升或下降過(guò)程中的沖擊。彈簧升降導(dǎo)桿使得載盤到上升限位時(shí)能夠緩慢過(guò)渡，降低了對(duì)載盤上表面的沖擊，也降低了由于升降沖擊振動(dòng)，而致使產(chǎn)品貼合偏離的風(fēng)險(xiǎn)。

The multi-stage harmonic CAM is used to reduce the drive chain and speed up the response of the lifting mechanism, while the harmonic CAM curve reduces the impact during the lifting or lowering of the plate. The spring lift guide allows a slow transition from the carrier to the lift limit, reducing the impact on the surface of the carrier and reducing the risk of product fit deviation due to lift shock vibration.

龍門雙驅(qū)結(jié)構(gòu)，快速又穩(wěn)定

貼合邦頭Y軸采用龍門雙驅(qū)結(jié)構(gòu)，在保證速度的同時(shí)，提高了運(yùn)行的穩(wěn)定性；龍門機(jī)構(gòu)底座采用整體鑄鐵結(jié)構(gòu)，降低了運(yùn)行時(shí)振動(dòng)的影響，整體精度進(jìn)一步提高。龍門X/Y軸電機(jī)外附氣冷裝置，降低了長(zhǎng)時(shí)間運(yùn)行溫變帶來(lái)的精度影響。

The Y axis of the bond head adopts the double drive structure of gantry, which ensures the speed and improves the stability of operation. The base of the gantry mechanism adopts an integral cast iron structure, which reduces the influence of vibration during operation and further improves the overall accuracy. The external air-cooling device of Gantry X/y axis motor reduces the influence of temperature variation caused by long-time operation.

自動(dòng)更換芯片頂針和吸嘴

設(shè)備支持自動(dòng)更換芯片頂針和吸嘴，芯片吸嘴庫(kù)最多可存放12個(gè)吸嘴，頂針帽庫(kù)最多可存放6種頂針帽，獨(dú)創(chuàng)的擺臂式頂針更換裝置，相比同類設(shè)備，更換時(shí)間節(jié)省60%，最多可支持同一型號(hào)產(chǎn)品4種不同芯片同時(shí)貼裝，極大加強(qiáng)了工藝可行性的容度。

The device supports automatic replacement of chip thimbles and nozzles. The chip nozzle library can store up to 12 nozzles, and the thimble cap library can store up to 6 types of thimble caps. The innovative swing arm thimble replacement device saves 60% of replacement time compared to similar devices, and can support up to 4 different chips of the same model product to be installed simultaneously, greatly enhancing the capacity of process feasibility.